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    • 专利摘要:
    glazing with electrical connection element and connecting bridge. glazing with at least one electrical connection element (3) with a connecting bridge (4), comprising at least: - a substrate (1) with an electrically conductive structure (2) in at least one sub-region of the substrate (1 ), - at least one electrical connecting element (3) in at least one sub-region of the electrically conductive structure (2), - a connecting bridge (4) in at least one sub-region of the connecting element (3) , and - a lead-free solder material (5), which connects the electrical connection element (3) to the electrically conductive structure (2) in at least one sub-region, in which the difference between the thermal expansion coefficients of the substrate (1) and the connecting element (3) is smaller than 5 x 10-6 / °c, where the connecting bridge (4) is implemented as a solid and contains copper, and where the material compositions of the connecting element (3) and the connecting bridge (4) are different.
    公开号:BR112015010476B1
    申请号:R112015010476-2
    申请日:2013-07-16
    公开日:2021-08-10
    发明作者:Mitja Rateiczak；Bernhard Reul；Klaus Schmalbuch；Lothar Lesmeister
    申请人:Saint-Gobain Glass France；
    IPC主号:
    专利说明:

    [0001] The invention refers to a panel with an electrical connection element, an economical and environmentally friendly method for its production, and its use.
    [0002] The invention further relates to a panel with an electrical connection element for motor vehicles, with electrically conductive structures, such as, for example, heating conductors or antenna conductors. Electrically conductive structures are customarily connected to the on-board electrical system via welded electrical connection elements. Due to the different coefficients of thermal expansion of the materials used, mechanical stresses occur during production and operation, which stress the panels and can cause panel breakage.
    [0003] Lead-containing solders have high ductility, which can compensate for the mechanical stresses occurring between an electrical connection element and the panel, by plastic deformation. However, due to the End of Life Vehicles Directive 2000/53/EC, lead-containing solders have to be replaced by lead-free solders within the EC. The directive is referred to, in short, by the acronym ELV (End of Life Vehicles). Their goal is to ban extremely problematic components from products resulting from the massive increase in disposable electronics. Substances affected are lead, mercury, cadmium and chromium. This refers, among other things, to the implementation of lead-free solder materials in electrical applications on glass and the introduction of corresponding replacement products.
    [0004] Known lead-free solder materials, as described, for example, in EP 2 339 894 A1 and WO 2000058051, are not, however, due to their lower ductility, capable of compensating mechanical stresses to the same extent than lead. Conventional copper-containing connecting elements, however, have a higher coefficient of thermal expansion than glass (CTE (copper) = 16.8 x 10-6 oC), as a result of which damage occurs in glass in the thermal expansion of copper . For this reason, connecting elements having a low coefficient of thermal expansion, preferably on the order of magnitude of soda-lime glass (8.3 x 10-6 oC for 0 oC - 320 oC), are preferably used together with lead-free solder materials. Such connecting elements hardly expand on warming and compensate for emerging tensions.
    [0005] EP 1 942 703 A2 describes an electrical connection element in motor vehicle panels, in which the difference between the thermal expansion coefficients of the panel and the electrical connection element is < 5 x -10-6 / oC and the connecting element predominantly contains titanium. In order to provide adequate mechanical stability and processability, the use of an excess of solder material is proposed. Excess weld material flows out of the intermediate space between the connecting element and the electrically conductive structure. Excess solder material causes high mechanical stresses on the glass panel. These mechanical stresses ultimately result in panel breakage. Titanium is also difficult to solder. This results in poor adhesion of the panel connecting element. The connecting element must furthermore be connected to the on-board electrical system via an electrically conductive material, eg copper, possibly by soldering. Titanium is difficult to solder.
    [0006] EP 2 408 260 A1 describes the use of ferronickel alloys or ferronickel-cobalt alloys, such as, for example, Kovar or Invar, which have a low coefficient of thermal expansion (CTE). Both Kovar (CTE = 5 X 10-6 / oC) and Invar (CTE as low as 0.55 x 10-6 / oC depending on composition) have a lower CTE than soda-lime glass and compensate for stresses mechanics. Invar has such a low coefficient of thermal expansion that overcompensation of these mechanical stresses occurs. This results in pressure stresses in the glass or stress stresses in the alloy, which should, however, be categorized as non-critical.
    [0007] An electrical connection of the connecting element in the on-board electronics generally occurs via a connecting bridge, where the on-board voltage is applied via a cable or similar. According to the prior art, this connecting bridge is formed in one piece with the connecting element and runs parallel with the bases of the connecting element. As described in WO 2007/110610 A1, the connecting element geometry of a part with a connecting bridge must be optimized for the effect that the lowest possible stresses occur in the weld joint.
    [0008] When the position of the connecting bridge, after installing the glazing, is often accessible only with difficulty, the connecting bridge is often pre-bent so that it points vertically upwards. In the case of copper-containing connecting elements with a connecting bridge formed in one piece, this re-moulding can be carried out very easily due to the plasticity of the material. However, due to copper's high coefficient of thermal expansion, these connecting elements are hardly suitable for soldering glass with lead-free solder materials. More suitable materials, for use with lead-free solder materials, such as steel or titanium alloys, for example, have substantially higher hardness than copper, as a result of which recasting of the connecting bridge is made significantly more difficult .
    [0009] The purpose of the present invention is to provide a panel with an electrical connection element and a connecting bridge, as well as an economical and environmentally friendly method for its production, in which critical mechanical stresses in the panel are avoided and the position of the bridge it is subsequently adjustable with simple tools.
    [0010] The purpose of the present invention is carried out according to the invention by a panel with a connecting element, a method for its production and its use according to independent claims 1, 13 and 15. Preferred embodiments emerge from sub-claims.
    [0011] The purpose of the present invention is carried out according to the invention by a panel with at least one connecting element with a connecting bridge, in which the material compositions of the connecting element and the connecting bridge are different. The arrangement comprises at least one substrate with an electrically conductive structure in at least one subregion of the substrate, at least one electrically connecting element in at least one subregion of the electrically conductive structure, a connecting bridge in at least one subregion. -region of the connecting element and a lead-free solder material, which connects the electrical connecting element to the electrically conductive structure in at least one sub-region. The material composition of the connecting element is selected so that the difference between the thermal expansion coefficients of the substrate and the connecting element is less than 5 x 10-6/oC. By this means, the thermal stresses of the panel are reduced and better adhesion is obtained. However, materials that have an adequate coefficient of thermal expansion often have high rigidity and/or high electrical resistance. However, the high rigidity of the connecting bridge makes re-molding more difficult, as a result of which the possibilities for subsequent adjustment of the bridge position, by bending the connecting bridge upwards, are limited. High electrical resistance of the connecting bridge is also disadvantageous, since, in the installed state, a voltage is to be applied to the electrically conductive structure and higher electrical resistance at the same voltage produces lower current flow. In the case of one-piece connecting elements, with a connecting bridge formed directly over them, known according to the prior art, the connecting element and the connecting bridge are necessarily made of the same material, so that the connecting element. connection has an adequate coefficient of thermal expansion, while the connecting bridge has excessively high stiffness and/or excessively low conductivity, or vice versa. On the contrary, the connecting element with a connecting bridge formed in two pieces according to the invention makes it possible to combine different materials, so that the connecting element itself is made of a material with a suitable thermal expansion coefficient. (Substrate CTE difference less than 5 x 10-6/oC), while the connecting bridge is made of a copper-containing material that has sufficiently good re-mouldability. Due to the fact that the material compositions of the connecting element and the connecting bridge are, by choice, different, the materials of the two components can be optimally adapted to the corresponding requirements. The connecting bridge according to the present invention contains copper and is implemented as a solid. As a result, it is, on the one hand, very re-mouldable and, at the same time, not highly flexible. A readily removable connecting bridge can be folded into the desired position with little effort. As a result, this procedure can be performed manually. The solid implementation of the connecting bridge ensures that, after re-molding, it also remains in the corresponding position. It is thus avoided that relatively small forces occur during installation of the panel or during contact of the connecting bridge, to change its position. This produces, even in the installed state of the panel, a readily accessible and precisely defined bridge position. Furthermore, non-solid, highly flexible forms, such as flat cables or conductors, which are completely unsuitable for use as a connecting bridge, are excluded. The electrical resistance of the connecting bridge is selected according to the invention so that a large voltage drop across the connecting bridge is avoided. The connecting element, with a connecting bridge according to the present invention, thus, because of its two-piece shape, optimally exploits the advantageous properties of the materials used in the corresponding locations and avoids the disadvantages of the one-piece connecting elements , known according to the prior art.
    [0012] The connecting element with a connecting bridge is implemented with multiple pieces, at least two pieces, with the connecting element and the connecting bridge, respectively, forming at least one component. In a preferred embodiment, the connecting element, with a connecting bridge, is implemented in two pieces, so that the connecting element and the connecting bridge each consist of one component. Alternatively, the connecting element and the connecting bridge can each also consist of any number of individual parts.
    [0013] In a preferred embodiment, the copper-containing material composition of the connecting bridge, is electrical resistance between 0.5 μ Ohm.cm and 20 μ Ohm.cm, preferably between 1.0 μ Ohm.cm and 15 μ Ohm.cm, particularly preferable between 1.5 μ Ohm.cm. This produces a particularly advantageous combination of a connecting element with a substrate-adapted CTE and a connecting bridge with improved conductivity. Comparable one-piece connecting elements according to the prior art, which also have a coefficient of thermal expansion adapted to the substrate, have higher electrical resistances of the connecting bridge, so that a disadvantageously increased voltage drop occurs.
    [0014] The connecting element has at least one contact surface, via which the connecting element is connected by means of the lead-free solder material across its entire surface to a sub-region of the electrically conductive structure. In a preferred embodiment, the connecting element is stamped in the form of a bridge, with the connecting element having two feet for contacting the electrically conductive structure, between which feet there is a raised section that does not make direct surface contact with the electrically conductive structure. The connecting element can include either a simple bridge shape or more complex bridge shapes. For example, a dumbbell shape with rounded feet, which both effect a uniform tensile stress distribution and allow for uniform weld distribution, is conceivable. Preferably, connecting elements with elongated solder feet are used, with the connecting element feet pointing in the same direction as the connecting bridge applied to the connecting element. Such a design results in an advantageous increase in the retraction force. In this embodiment too, the corners of the connecting element can be rounded in the region of the contact surfaces, so that both an even distribution of the weld occurs and maximum values of tensile stresses at the corners are avoided.
    [0015] The thermal expansion coefficients of the connecting element are preferably between:
    [0016] 9 x 10-6 / oC and 13 x 10-6 / oC, particularly preferable between 10 x 10-6 / oC and 11.5 x 10-6 / oC, very particularly preferable between 10 x 10-6 / oC and 11 x 10-6 / oC, and in particular between 10 x 10-6 / oC and 10.5 x 10-6/oC, in a temperature range of 0 oC to 300 oC.
    [0017] Unlike the connecting bridge, the connecting element has high rigidity and is difficult to remold. This prevents deformation of the connecting element when bending the connecting bridge. Particularly with shaped bridging connecting elements, a bending of the bridging region occurs when re-molding the connecting bridge, which also results in damage to the solder connection between the connecting element and the electrically conductive structure. Such deformation of the connecting element can be avoided, on the one hand, by selecting a suitable geometry and, on the other hand, by using a material that is difficult to reshape. In a preferred embodiment, the material of the connecting element has, at 20°C, a modulus of elasticity greater than or equal to 150 kN/mm2, particularly preferable greater than or equal to 190 kN/mm2.
    [0018] The connecting element according to the present invention contains titanium, iron, nickel, cobalt, molybdenum, copper, zinc, tin, manganese, niobium and/or chromium and/or their alloys.
    [0019] The connecting element according to the present invention preferably contains a steel containing chromium, with a proportion of chromium greater than or equal to 10.5% by weight. Furthermore, alloy components such as molybdenum, manganese or niobium result in improved corrosion stability or altered mechanical properties such as tensile strength or cold moldability.
    [0020] The connecting element according to the present invention preferably contains at least 66.5% by weight to 89.5% by weight of iron, 10.5% by weight to 20% by weight of chromium, 0% by weight weight to 1% by weight carbon, 0% by weight to 5% by weight nickel, 0% by weight to 2% by weight manganese, 0% by weight to 2.5% by weight molybdenum, 0% by weight weight to 2% by weight of niobium, and 0% by weight to 1% by weight of titanium. In addition, the connecting element may contain mixtures of other elements, including vanadium, aluminum and nitrogen.
    [0021] The connecting element particularly preferably contains at least 73 % by weight to 89.5% by weight of iron, 10.5% by weight to 20% by weight of chromium, 0 % by weight to 0.5% by weight weight carbon, 0% by weight to 2.5% by weight nickel, 0% by weight to 1% by weight manganese, 0% by weight to 1.5% by weight molybdenum, 0% by weight to 1 wt% niobium and 0 wt% to 1 wt% titanium. In addition, the connecting element may contain mixtures of other elements, including vanadium, aluminum and nitrogen.
    The connecting element contains very particularly preferably at least 77% by weight to 84% by weight of iron, 16% by weight to 18.5% by weight of chromium, 09% by weight to 0.1% by weight of carbon, 0% by weight to 1% by weight of manganese, 0% by weight to 1% by weight of niobium, 0% by weight to 1.5% by weight of molybdenum and 0% by weight to 1% by weight of titanium. In addition, the connecting element may contain mixtures of other elements, including vanadium, aluminum and nitrogen.
    [0023] Chromium containing steel, in particular called “stainless steel” or “corrosion resistant steel”, is economically available. Connecting elements made of chromium-containing steel also have high rigidity compared to many conventional connecting elements made, for example, of copper, which results in an advantageous stability of the connecting element. Particularly, with the preferred bridge-shaped connecting elements, a twisting of the connecting element when re-molding the connecting element can thus be avoided. Furthermore, compared to many conventional connecting elements, for example those made of titanium, steel containing chromium has improved weldability due to higher thermal conductivity.
    [0024] Particularly suitable chromium-containing steels are steels of material numbers 1.4016, 1.4113, 1.4509 and 1.4510 according to EN 10.088-2.
    [0025] The material thickness of the connecting element is preferably 0.1 mm to 2 mm, particularly preferable 0.2 mm to 1 mm, very particularly preferable 0.3 mm to 0.5 mm. In a preferred embodiment, the domatrial thickness of the connecting element is constant over its entire region. This is particularly advantageous with respect to the simple production of the connecting element.
    [0026] The connecting bridge contains copper or alloys containing copper. In addition, titanium, iron, nickel, cobalt, molybdenum, zinc, tin, manganese, niobium, silicon and/or chromium and/or their alloys can be contained. A suitable material composition is selected according to its electrical resistance.
    [0027] In a preferred embodiment, the connecting bridge contains 45.0% by weight to 99.9% by weight copper, 0% by weight to 45% by weight zinc, 0% by weight to 15% by weight of tin, 0% by weight to 30% by weight of nickel and 0% by weight to 5% by weight of silicon. In addition to electrolytic copper, a wide variety of brass or bronze alloys are suitable as materials, eg nickel, silver or Konstantan.
    Particularly preferably, the connecting bridge contains 58% by weight to 9.9% by weight of copper and 0% by weight to 37.0% by weight of zinc, in particular 60% by weight to 80% by weight of copper and 20% by weight to 0% by weight of zinc.
    [0029] As a special example for the connecting bridge material, electrolytic copper with material number CW004A (formerly 20065) and CuZn30 with material number CW505L (formerly 2.0265) should be mentioned.
    [0030] The connecting bridge is preferably applied on the stamped bridge-shaped part of the connecting element, which has no direct surface contact with the electrically conductive structure. The purpose of the connecting bridge is to make it possible to connect the connecting element to the electronics on board a vehicle.
    [0031] The current flow flows via the feet of the connecting element to the central part of the connecting element, where the connecting bridge is arranged, and then to the connecting bridge. The centrally applied connecting bridge thus forms a node and the various undercurrents are combined. As a result of this, a low electrical resistance of the connecting bridge is of particular significance in order to obtain the highest possible conductivity and thus the smallest possible voltage drop at this node.
    [0032] The connecting bridge can be formed into a wide variety of geometries and preferably has an elongated shape. Both round and flat embodiments are conceivable. Elongated rectangular connecting bridges, which make a flat surface possible for optimal application of the connecting bridge onto the connecting element, are preferred. The width of such a rectangular connecting bridge is 2 mm to 8 mm, preferably 4 mm to 7 mm, particularly preferable 4.5 mm to 6.5 mm, while its height measures 0.2 mm to 2 mm, preferably 0. 5mm to 1.5mm, particularly preferable 0.7mm to 0.9mm. The length of the connecting bridge is highly variable. The minimum length of the connecting bridge depends on the contact that is selected to electrically conductively connect the connecting bridge to a voltage source. A plug connector that is run to the free end of the connecting bridge therefore has a greater space requirement than, for example, a cable that is soldered directly onto the connecting bridge. The connecting bridge is preferably shaped so that the free end no longer runs parallel to the substrate and points away from it. Therefore, the connecting bridge must be quite long so that this remodeling can be performed. Typically, connecting bridges with a length of 10 mm to 150 mm, preferably 20 mm to 80 mm, are used.
    [0033] In a preferred embodiment, the connecting bridge is dimensioned so that standard automotive blade terminals with a height of 0.8 mm and a width of 4.8 mm, 6.3 mm or 9.5 mm, can be plugged onto the free end of the connecting bridge. The connecting bridge embodiment, with a width of 6.3 mm, is particularly preferably used, as this corresponds to the automotive plugs according to DIN 46244, conventionally used in this sector. Standardizing the connecting bridge adapted to the size of conventional flat automotive plugs produces a simple yet reversible capability for connecting the substrate's conducting structure to on-board voltage. In the event of a broken connection cable, no soldered connections have to be remade to replace the defective part; instead, the replacement cable is simply plugged into the connecting bridge. Alternatively, the electrical contact of the connecting bridge can, however, also take place via a soldered connection or a kneading connection.
    [0034] Usable connecting cables for contacting the connecting bridge are, in principle, all cables which are known to the person skilled in the art for electrical contact of an electrically conductive structure. The connecting cable may include, in addition to an electrically conductive core (internal conductor), an insulating coating, preferably polymeric, with the insulating coating preferably removed at the end region of the connecting cable, to enable an electrically conductive connection between the element of connection and the inner conductor.
    [0035] The electrically conductive core of the connecting cable may, for example, include copper, aluminum and/or silver or alloys or mixtures thereof. The electrically conductive core can, for example, be implemented as a stranded wire conductor or as a solid wire conductor. The cross section of the electrically conductive core of the connecting cable depends on the current holding capacity required for the application of the panel according to the present invention and can be appropriately selected by the person skilled in the art. The cross section is, for example, from 0.3 mm2 to 6 mm2.
    [0036] The connecting bridge is electrically conductively connected to the connecting element, with the possibility of connecting the element using various welding techniques. Preferably, the connecting bridge and the connecting element are connected using electrode resistance welding, ultrasonic welding, or friction welding.
    [0037] In at least one sub-region of the panel, an electrically conductive structure, which preferably contains silver, particularly preferably silver particles and glass frits, is mounted. The electrically conductive structure according to the present invention preferably has a layer thickness of 3 µm to 40 µm, particularly preferable from 5 µm to 20 µm, very particularly preferable from 7 µm to 15 µm and in particular from 8 μm to 12 μm. The connecting element is connected via a contact surface over its entire surface to a sub-region of the electrically conductive structure. Electrical contact is via lead-free solder material. The electrically conductive structure can, for example, serve to contact wires or a coating applied over the panel. The electrically conductive structure is applied, for example, in the form of busbars on opposite edges of the panel. A voltage can be applied via the connecting elements applied to the distribution bars, as a result of which current flows through the conducting wires or coating from one distribution bar to the other and heats the panel. As an alternative to such a heating function, the panel according to the present invention could also conceivably be used in combination with antenna conductors or even in any other arrangement where a stable contact of the panel is required.
    [0038] The substrate preferably contains glass, particularly preferably flat glass, float glass, quartz glass, borosilicate glass and/or soda-lime glass. The substrate may, however, also contain polymers, preferably polyethylene, polypropylene, polycarbonate, polymethyl methacrylate, polystyrene, polybutadiene, polynitriles, polyester, polyurethane, polyvinyl chloride, polyacrylates, polyamide, polyethylene terephthalate and/or copolymers or mixtures thereof. The substrate is preferably transparent. The substrate preferably has a thickness of from 0.5mm to 25mm, particularly preferably from 1mm to 10mm and very particularly preferably from 1.5mm to 5mm.
    [0039] The thermal expansion coefficient of the substrate is preferably from 8 x 10-6/oC to 9 x 10-6/oC. The substrate preferably contains glass which preferably has a thermal expansion coefficient of 8.3 x 10-6/oC to 9 x 10-6/oC over a temperature range of 0 oC to 300 oC.
    [0040] The electrically conductive structure is electrically and conductively connected to the connecting element via the lead-free solder material. Lead-free solder material is disposed on the contact surfaces that are situated on the underside of the connecting element.
    [0041] The layer thickness of the lead-free solder material is preferably less than or equal to 600 μm, particularly preferable between 150 μm and 600 μm, in particular less than 300 μm.
    [0042] The lead-free solder material is preferably lead-free. This is particularly advantageous in view of the environmental impact of the panel with an electrical connection element according to the present invention. In the context of the invention, "lead-free solder material" means a solder material which includes, in accordance with EC Directive "2002/95/EC on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment", a proportion of lead less than or equal to 0.1% by weight, preferably no lead.
    [0043] Lead-free solder materials typically have less ductility than lead-containing solder materials, so mechanical stresses between a connecting element and a panel may be less well compensated for. However, it has been demonstrated that critical mechanical stresses can be avoided by means of the connecting element according to the present invention. The solder material preferably contains tin and bismuth, indium, zinc, copper, silver or compositions thereof. The proportion of tin in the solder composition according to the present invention is from 3% by weight to 99.5% by weight, preferably from 10% by weight to 99.5% by weight, particularly preferably 15% by weight to 60 % % by weight. The proportion of bismuth, indium, zinc, copper, silver or their compositions in the solder composition according to the present invention is from 0.5% by weight to 97% by weight, preferably 10% by weight to 67% by weight, whereby the proportion of bismuth, indium, zinc, copper or silver may be 0% by weight. The solder composition can contain nickel, germanium, aluminum or phosphorus in a proportion of 0% by weight to 5% by weight. The soldering composition according to the present invention contains, very particularly preferably, Bi40Sn57Ag3, Sn40Bi57Ag3, Bi59Sn40Ag1, Bi57Sn42Ag1, In97Ag3, In60Sn36, 5Ag2Cu1.5, Sn95.5Ag3.8Cu0.7, Bi67In33, Bi33In50Sn17, Sn77,2 Sn95Ag4Cu1, Sn99Cu1, Sn96.5Ag3.5, Sn96.5Ag3Cu0.5, Sn97Ag3, or mixtures thereof.
    [0044] In an advantageous embodiment, the solder material contains bismuth. It has been shown that a bismuth-containing solder material results in particularly good adhesion of the connecting element, according to the present invention, to the panel, whereby damage to the panel can be prevented. The proportion of bismuth in the composition of the solder material is preferably from 0.5% by weight to 97% by weight, particularly preferably 10% by weight to 67% by weight and very particularly preferably from 33% by weight to 67% by weight, in particular from 50% by weight to 60% by weight. In addition to bismuth, the solder material preferably contains tin and silver or tin, silver and copper. In a particularly preferred embodiment, the solder material comprises at least 35% by weight to 69% by weight bismuth, 30% by weight to 50% by weight tin, 1% by weight to 10% by weight silver and 0 wt% to 5 wt% copper. In a very particularly preferred embodiment, the solder material contains at least 49% by weight to 60% by weight of bismuth, 39% by weight to 42% by weight of tin, 1% by weight to 4% by weight of silver and 0 wt% to 3 wt% copper.
    [0045] In another advantageous embodiment, the solder material contains from 90% by weight to 99.5% by weight of tin, preferably from 95% by weight to 99% by weight, particularly preferable from 93% by weight to 98% by weight. In addition to tin, the solder material preferably contains from 0.5% by weight to 5% by weight of silver and from 0% by weight to 5% by weight of copper.
    [0046] The solder material flows outward with an outflow width of preferably less than 1 mm from the intermediate space between the solder region of the connecting element and the electrically conductive structure. In a preferred embodiment, the maximum outflow width is less than 0.5 mm and in particular approximately 0 mm. This is particularly advantageous with respect to the reduction of the mechanical stresses of the panel, the adhesion of the connecting element and the savings in the amount of solder. The maximum efflux width is defined as the distance between the outer edges of the weld region and the crossing point of the weld material, where the weld material falls below a layer thickness of 50 μm. The maximum flux width is measured on the solidified weld material after the welding process. The maximum desired outflow width is achieved by a suitable selection of the volume of solder material and by the vertical distance between the connecting element and the electrically conductive structure, which can be determined by simple experiments. The vertical distance between the connecting element and the electrically conductive structure can be predefined by an appropriate processing tool, eg a tool with an integrated spacer. The maximum width and efflux can even be negative, that is, retracted into the intermediate space formed by the solder region of the electrical connection element and an electrically conductive structure. In an advantageous embodiment of the panel according to the present invention, the maximum outflow width is recessed in a concave meniscus into the intermediate space formed by the soldering region of the electrical connection element and the electrically conductive structure. A concave meniscus is created, for example, by increasing the vertical distance between the spacer and the conducting structure during the welding process, while the weld is still fluid. The advantage lies in the reduction of the mechanical stresses of the panel, in particular in the critical region that is present with a large crossover of solder material.
    [0047] In an advantageous embodiment of the invention, the contact surface of the connecting element has spacers, preferably at least two spacers, particularly preferably at least three spacers. The spacers are preferably implemented in one piece with the connecting element, for example stamping or deep drawing. The spacers preferably have a width of 0.5 x 10-4 m to 10 x 10-4 m and a height of 0.5 x 10-4 m to 5 x 10-4 m, particularly preferably of 1 x 10-4 m to 3 x 10-4 m. By means of the spacers, a homogeneous, uniformly thick and uniformly fused layer of the solder material is obtained. Thus, mechanical stresses between the connecting element and the panel can be reduced and the adhesion of the connecting element can be improved. This is particularly advantageous with the use of lead-free solder materials, which can compensate for mechanical stresses less well due to their lower ductility compared to lead-containing solder materials.
    [0048] In an advantageous embodiment of the invention, at least one contact stop, which serves to contact the connecting element with the welding tool during the welding process, is disposed on the surface of the welding region of the welding element. connection facing away from the substrate. The contact stop is preferably convexly curved at least in the region of contact with the welding tool. The contact stop preferably has a height of 0.1 mm to 2 mm, particularly preferably 0.2 mm to 1 mm. The length and width of the contact stop is preferably between 0.1 and 5 mm, very particularly preferable between 0.4 mm and 3 mm. Contact stops are preferably implemented in one piece as a connecting element, for example by stamping or deep drawing. For welding electrodes, whose contact side is flat, can be used. The electrode surface is brought into contact with the contact stop. For this, the electrode surface is arranged parallel to the substrate surface. The contact region, between the electrode surface and the contact abutment, forms the solder joint. The position of the solder joint is determined by the point on the convex surface of the contact stop, which has the greatest vertical distance from the substrate surface. The position of the soldering joint is independent of the position of the soldering electrode on the connecting element. This is particularly advantageous with respect to a reproducible and uniform thermal distribution during the welding process. Thermal distribution during the welding process is determined by the position, size, arrangement and geometry of the contact pad.
    [0049] The electrical connection element preferably has, at least on the contact surface facing the solder material, a coating (wetting layer) that contains nickel, copper, zinc, tin, silver, gold or alloys or their layers, preferably silver. By this means, wetting of the connecting element with the solder material and improved adhesion of the connecting element are achieved.
    [0050] The connecting element according to the present invention is preferably coated with nickel, tin, copper and/or silver. The connecting element according to the present invention is particularly preferably provided with an adhesion-promoting layer, preferably made of nickel and/or copper, and additionally with a solderable layer, preferably made of silver. The connecting element according to the present invention is very particularly and preferably coated with 0.1 µm to 0.3 µm of nickel and/or 3 µm to 20 µm of silver. The connecting element can be galvanized with nickel, tin, copper and/or silver. Nickel and silver improve the current-carrying capacity and the corrosion stability of the connecting element and wetting with the solder material.
    [0051] The connecting bridge can optionally also have a sheath. A coating of the connecting bridge is, however, not essential as there is no direct contact between the connecting bridge and the weld material. Thus, no optimization of the wetting properties of the connecting bridge is required. This reduces the production costs of the panel according to the present invention with a connecting element and a connecting bridge, since coating of the connecting bridge can be dispensed with and only the connecting element is coated.
    [0052] In an alternative embodiment, the connecting bridge has a coating that contains nickel, copper, zinc, tin, silver, gold or alloys or their layers, preferably silver. Preferably, the connecting bridge is coated with nickel, tin, copper and/or silver. Very particularly, preferably the connecting bridge is coated with 0.1 µm to 0.3 µm nickel and/or 3 µm to 20 µm silver. The connecting bridge can be galvanized with nickel, tin, copper and/or silver.
    [0053] The shape of the electrical connection element can form one or a plurality of solder deposits in the intermediate space of the connecting element and the electrically conductive structure. The weld deposits and wetting properties of the weld in the connecting element prevent the efflux of weld material from the intermediate space. Weld deposits can be rectangular, rounded or polygonal in design.
    [0054] The invention further includes a method for producing a panel with a two-piece connecting element with a connection including the following steps:
    [0055] a) a connecting bridge is electrically affixed conductively over the top of the connecting element,
    [0056] b) at the bottom of the connecting element, a lead-free solder material is applied to at least one contact surface,
    [0057] c) the connecting element with the lead-free solder material is disposed on an electrically conductive structure, and
    [0058] d) the connecting element is welded to the electrically conductive structure.
    [0059] The electrically conductive structure can be applied to the substrate by methods known per se, for example, by screen printing methods. The application of the electrically conductive structure can take place before, during or after processing steps (a) and (b).
    [0060] The solder material is preferably applied to the connecting element as a flat plate or droplet with a fixed thickness, volume, shape and layer arrangement.
    [0061] The layer thickness of the solder material platelet is preferably less than or equal to 0.6 mm. The shape of the solder material plate preferably corresponds to the shape of the contact surface. If the contact surface is implemented, for example, as a rectangle, the solder material plate has a rectangular shape.
    [0062] The introduction of energy during the electrical connection of an electrical connection element and an electrically conductive structure preferably occurs through perforations, thermos, piston welding, microflame welding, preferably laser welding, hot air welding, welding by induction, resistance welding and/or with ultrasound.
    [0063] Preferably, the connecting bridge is welded to the top of the connecting element. Particularly preferable, the connecting bridge is affixed to the connecting element by electrode resistance welding, ultrasonic welding or friction welding.
    [0064] Following process step (d), a remodeling of the connecting bridge is optionally performed. Since the free end of the connecting bridge is only reachable with difficulty after installing the panel on the vehicle body, the reshaping of the connecting bridge enables substantially improved accessibility of the point position. Furthermore, by means of this folding, a precisely defined bridge position is obtained. After reshaping, the free end of the connecting bridge points away from the substrate. The angle that the free end of the connecting bridge assumes with respect to the substrate surface is freely selectable depending on requirements. Since the connecting bridge according to the present invention is readily remoldable, only slight forces should be applied for bending the connecting bridge. Since the connecting bridge is made of a solid material and is not highly flexible, plastic reshaping takes place and the position of the connecting bridge is precisely definable. The reshaping of the connecting bridge according to the present invention takes place purely manually and without any tools. With light forces occurring, twisting of the connecting element, which is substantially more rigid compared to the connecting bridge, is avoided. In this way, associated damage to the solder joint is also avoided.
    [0065] After installation of the panel in the vehicle and possible remoulding, the connecting bridge is connected to the on-board electronics, via a plug connector, a metal plate, a braided wire or a braided conductor, made, for example, of copper. Preferably, a plug connector is selected which, on the one hand, ensures lasting stability and prevents the contact from slipping out of position, but is, on the other hand, also reversible. As a result, the connecting cable between the connecting bridge and the on-board electronics can be replaced in a simple manner if damaged. On the contrary, the other mentioned contact possibilities require contact welding.
    [0066] The invention also includes the use of the panel with electrically conductive structures according to the present invention in vehicles, architectural glass or building glass, in particular in motor vehicles, railroad vehicles, aircraft or boats. The connecting element serves for connecting electrically conductive structures of the panel, such as, for example, heating conductors or antenna conductors, to external electrical systems, such as amplifiers, control units or voltage sources. The invention includes in particular the use of the panel according to the present invention in railway vehicles or motor vehicles, preferably as a windshield, rear window, side window and/or glass roof, in particular as a heatable panel or a panel with antenna function.
    [0067] The invention is explained in detail with reference to drawings and exemplary embodiments. Drawings are schematic representations and not true scale. The drawings in no way limit the invention. They represent:
    [0068] Fig. 1 is a schematic perspective view of a panel with a connecting element and a connecting bridge, according to the present invention.
    [0069] Fig. 2 is a cross section of the panel according to Fig.1, along section line AA’.
    [0070] Fig. 3 is a top plan view of the panel according to Fig.1.
    [0071] Fig. 4 illustrates a panel according to the present invention, according to Fig. 1 and 2, with a connecting element and remolded connecting bridge.
    [0072] Fig. 5a is a top plan view of another embodiment of the panel with a connecting element and a connecting bridge, according to the present invention, as well as contact stops and spacers.
    [0073] Fig. 5b is a cross section of the panel according to Fig. 5a, along section line BB’.
    [0074] Fig. 6 is a flowchart of the method according to the present invention for producing a panel with a connecting element and a connecting bridge.
    [0075] Fig. 1 represents a panel with a connecting element (3) and a connecting bridge (4), according to the present invention. A cover screen (6) is applied to a substrate (1) made of a 3 mm thick, thermally pre-stressed, single-pane safety glass made of soda-lime glass. The substrate (1) has a width of 150 cm and a height of 80 cm, with a connecting element (3) with a connecting bridge (4) mounted on the shorter side edge of the cover screen printing region (6) . An electrically conductive structure (2), in the form of a heating conductor structure, is applied to the surface of the substrate (1). The electrically conductive structure contains silver particles and glass frits, with the proportion of silver being greater than 90%. In the edge region of the panel (1), the electrically conductive structure (2) is widened to a width of 10 mm. In this region, a lead-free solder material (5), which connects the electrically conductive structure (2) to the contact surfaces (7) of the connecting element (3), is applied. After installation in the vehicle body, the contact is hidden by the cover screen (6). The lead-free soldering material (5) ensures a durable electrical and mechanical connection from the electrically conductive structure (2) to the connecting element (3). Lead-free solder material (5) contains 57 wt% bismuth, 42 wt% tin and 1 wt% silver. The lead-free solder material (5) has a thickness of 250 μm. The connecting element (3) has a bridge shape. The connecting element includes two feet, each with a contact surface (7.1, 7.2) on its underside and a bridge-shaped section that extends between the feet. In the bridge-shaped section, the connecting bridge (4) is welded to the surface of the connecting element (3). The connecting bridge (4) is flush aligned with an outer edge of the connecting element (3) and points beyond the opposite outer edge towards the feet of the connecting element (3), with the connecting element (3) and the connecting bridge (4), together producing an E-shaped arrangement. The electrical connecting element (3) has a width of 4 mm and a length of 24 mm and is made of steel of material number 1.4509, according to EN 10 088-2 (ThyssenKrupp Nirosta® 4509) with a thermal expansion coefficient of 10.5 x 10-6 / oC in the temperature range of 20 oC to 300 oC. The material thickness of the connecting element (3) is 0.8 mm. The connecting bridge (4) has a height of 0.8 mm, a width of 6.3 mm, and a length of 27 mm. The connecting bridge (4) is made of copper material number CW004A (Cu-ETP), with an electrical resistance of 1.8 μ Ohm.cm.
    [0076] Fig. 2 represents a cross section of the panel according to Fig. 1, along section line AA’. The covering seritypy (6) is applied on the substrate (1) on which the electrically conductive structure (2) is situated. The bridged section of the connecting element (3), which is cut by the section line AA’, is represented with hatched lines, while the foot of the connecting element (3) is represented with dots. The connecting bridge (4) is located on the bridge-shaped section of the connecting element (3) and is welded there. The second contact surface (7.2), on which the foot of the connecting element (3) contacts the electrically conductive structure (2), is situated in the lower part of the connecting element (3). Lead-free solder material (5) is applied on the second contact surface (7.2) for the electrically conductive and mechanically stable connection of the connecting element and the electrically conductive structure. Lead-free solder material (5) flows outward through the concave meniscus of the gap between the connecting element (3) and the electrically conductive structure (2). The connecting element part (3), with the first contact surface (7.1) (not shown), is configured analogous to the connecting element part (3) described here.
    [0077] Fig. 3 represents a top plan view of the panel according to Fig. 1. The connecting element (3) and the connecting bridge (4) together form an E-shaped arrangement in that the connecting bridge (4) runs between the feet of the connecting element (3), parallel to it, and points in the same direction.
    [0078] Fig. 4 represents a panel according to the invention, according to Fig. 1 and 2, with a connecting element (3) and a remolded connecting bridge (4) along section line AA '. The general structure of the panel represented according to the invention corresponds to that described in Fig. 1 and 2, with the connecting bridge (4) bent upwards away from the substrate (1). The free end of the connecting bridge (4), which is not directly connected to the connecting element (3), assumes an angle of 90° to the substrate surface (1) and points away from it. In this way, even in the installed state, the position of the bridge is substantially more accessible and is precisely defined.
    Figs. 5a and 5b represent another embodiment of the panel according to the present invention with a connecting element (3) and a connecting bridge (4), as well as additional spacers (8) and contact stops (9). In the top plan view, shown in Fig. 5a, the spacers (8) are hidden by the connecting element (3). Fig. 5b represents a cross section through a foot of the connecting element (3) along section line BB’. The cut surfaces of the connecting element are represented with hatched lines. The view shown in Fig. 5b makes two spacers (8) on the first contact surface (7.1) of the connecting element (3) discernible. The second contact surface (7.2) has two similarly arranged spacers (not shown here). The spacers (8) are stamped onto the contact surfaces (7) of the foot of the connecting element (3) and thus implemented in one piece with them. The spacers (8) are shaped as spherical segments and have a height of 2.5 x 10-4 m and a width of 5 x 10-4 m. The formation of a uniform layer of lead-free solder material (5) is promoted by the spacers (8). This is particularly advantageous with respect to the adhesion of the connecting element (3). The contact stops (9) are arranged on the surface of the connecting element (3) facing away from the substrate (1) opposite the contact surfaces (7). The contact stops (9) are stamped on the foot of the connecting element (3) and thus implemented in one piece with them. The contact stops (9) are shaped as a spherical segment and have a height of 2.5 x 10-4+ m and a width of 5 x 10-4 m. The contact stops (9) serve to contact the connecting element (3) with the welding tool during the welding procedure. By means of the contact stops (9), a reproducible and defined heat distribution is ensured, regardless of the exact positioning of the welding tool.
    [0080] Fig. 6 represents a flowchart of the method according to the present invention for producing a panel with a connecting element (3) and a connecting bridge (4). First, a connecting bridge (4) is electrically applied conductively on top of the connecting element (3). Then, a lead-free solder material (5) is applied at the bottom of the connecting element (3) on at least one contact surface (7), and the connecting element (3) is arranged with the material of lead-free solder (5) onto the electrically conductive structure (2). After that, the connecting element (3) is welded to the electrically conductive structure (2). Preferably, the connecting bridge (4) is then reshaped by a one-sided load onto the outer free end of the connecting bridge, to ensure better accessibility of the connecting bridge (4). The remoulding of the connecting bridge (4) can take place directly after the preceding step or only after installation of the panel on the vehicle body, preferably after installation of the panel.
    [0081] Next, the invention is compared, using a series of panel tests, with one-piece connecting elements, according to the prior art, and the panel according to the invention, with a connecting element two-piece and connecting bridge, in each case together with a lead-free solder material.
    [0082] Table 1 presents a small selection of different materials that can be used in the known connection elements according to the prior art and/or in the connection elements according to the invention. The references listed in the last column refer to the source of the physical properties indicated.

    Source 1: Werkstoffdatenblatter Deutsches Copperinstitut [Germanic Copper Institute, Material Data Sheets] Source 2: Werkstoffdatenblatter ThyssenKrupp [ThyssenKrupp, Material Data Sheets]
    [0083] In a series of tests, a connecting element (3) according to the present invention, with a connecting bridge (4), was compared with three different connecting elements according to the prior art. To ensure comparability, both the two-piece connecting element with a connecting bridge according to the present invention and the one-piece formed connecting elements known according to the prior art were used in the same geometry. The geometry of the connecting elements corresponded to the arrangement shown in Fig. 1. As a substrate (1), a single thermally pre-stressed panel safety glass, 3 mm thick, made of soda-lime glass, with a seritypy of cover (6) was applied. The substrate (1) had a width of 150 cm and a height of 80 cm, with a connecting element with a connecting bridge (4) having been mounted over the shorter side edge of the seritypal region (6). The connecting elements used in each case included two feet each with a contact surface (7.1, 7.2) on their underside. An electrically conductive structure (2), in the form of a heat conductive structure, was applied to the surface of the substrate (1). The electrically conductive structure contained silver particles and glass frits, with selected silver proportion greater than 90%. In the edge region of the panel (1), the electrically conductive structure (2) was enlarged to 10mm. The different connecting elements were assembled in this region. For this, a lead-free solder material (5), made of 57% by weight of bismuth, 42% by weight of tin and 1% by weight of silver was used, which was applied with a thickness of 250 μm between the contact surfaces (7) of the connecting element and the electrically conductive structure (2). The connecting elements used in the example and comparative examples had the same bridge shape. In each case, a connecting bridge on the surface of the connecting element has been located in the bridge-shaped section of the connecting element. The connecting bridge was aligned level with the outer edge of the connecting element and pointed beyond the opposite outer edge, towards the feet of the connecting element, with the connecting element and connecting bridge together producing an E-shaped arrangement . The connecting elements used had a width of 4 mm and a length of 24 mm. The material thickness of the connecting elements was 0.8 mm and the connecting bridge had a height of 0.8 mm, a width of 6.3 mm and a length of 27 mm. In the comparative examples, the connecting bridges were formed in one piece with the connecting elements and thus were made of the same material. In the example according to the invention, the connecting bridge (4) has been welded onto the surface of the connecting element (3) according to the invention. The connecting bridge (4) and the connecting element (3) were in this case formed in two pieces and made of different materials.
    [0084] Table 2 presents the materials of the connecting element and the connecting bridge used in the example according to the invention and in the comparative examples, as well as the execution of one piece or two pieces of the connecting element and connecting bridge .

    The specimens from Example 1 and Comparative Examples 2 to 4 were subsequently subjected to a wide variety of tests. In a first series of tests, specimens were investigated in a temperature change test with respect to their stability, in which they were subjected to a temperature change from +80 oC to -30 oC. In a second series of tests, the connecting bridges were bent upwards away from the substrate (1) at an angle of 90° as shown in Fig. 4. Following this, the specimens were examined for damage to the solder joint and connecting element twisting. Also the electrical resistances of the respective connecting bridges are compared. These are a measure of the conductivity of the connecting bridges, which should be as high as possible. Table 3 shows the test series results for Example 1 as well as for Comparative Examples 2 to 4.

    [0086] As can be seen in Table 3, only in Example 1 and Comparative Example 3 no damage whatsoever occurred in the specimen in the temperature change test, as well as in the occasion of the re-molding of the connecting bridge. In Comparative Example 2, the specimen malfunctioned in the temperature change tests. Due to the different thermal expansion coefficients of the substrate and the connecting element, glass chipping occurred in the region of the connecting element contact surfaces. Furthermore, in Comparative Example 2, the solder joint was damaged when the connecting bridge was re-molded. Since the connecting element of Comparative Example 2 was made of easily remoldable copper, on the occasion of bending the connecting bridge, twisting of the bridge-shaped connecting element occurred, which resulted in this damage. In Comparative Example 4, no damage to the specimen occurred in the temperature change tests; however, due to inadequate rigidity of the connecting element, there was damage to the solder joint during the re-moulding process. It should also be mentioned that the titanium material used in Comparative Example 4 is expensive and can only be soldered with difficulty. Such specimen damage cannot be tolerated in routine production, so only Example 1 and Comparative Example 3 have adequate stability. In Comparative Example 3, the connecting element and the connecting bridge are made of a weakly conductive steel, as a result of which, compared to Example 1 according to the present invention, a significantly greater voltage drop occurs in the bridge. connection. This must be kept as low as possible in order to ensure optimal current flow. Thus, only the solution of Example 1 provides a connecting element that has adequate temperature stability and a connecting bridge that is retractable at will, in which only a slight voltage drop occurs. This result was unexpected and surprising to the person skilled in the art.Reference Character List1 transparent substrate2 conductive structure3 connecting element4 connecting bridge5 lead-free solder material6 seritipia7 contact surfaces7.1 first contact surface7.2 second contact surface8 spacers 9 contact stopsAA' section lineBB' section line
    权利要求:
    Claims (19)
    [0001]
    1. Panel with at least one electrical connection element (3), with a connecting bridge (4), characterized in that it comprises at least:- one substrate (1) with an electrically conductive structure (2) in at least a sub-region of the substrate (1), - at least one electrical connection element (3) in at least one sub-region of the electrically conductive structure (2), - a connecting bridge (4) in at least one sub- region of the connecting element (3), wherein the connecting element (3) contains at least 66.5% by weight to 89.5% by weight of iron, 10.5% by weight to 20% by weight of chromium , and one or more selected from the group of carbon, nickel, manganese, molybdenum, niobium and titanium, and - a lead-free solder material (5), which connects the electrical connection element (3) to the electrically conductive structure (2 ) in at least one sub-region, where the difference between the thermal expansion coefficients of the substrate (1) and the connecting element (3) is less than 5 x 10-6/oC, where the bridge d and connection (4) is implemented as a solid and contains copper, and wherein the material compositions of the connecting element (3) and the connecting bridge (4) are different.
    [0002]
    2. Panel according to claim 1, characterized in that the connecting element (3) contains at least 77% by weight to 84% by weight of iron and 16% by weight to 18.5 % by weight of chrome.
    [0003]
    3. Method for producing a panel as defined in claim 1, characterized in that it comprises: electrically and conductively affixing a connecting bridge (4) on top of the connecting element (3). applying a lead-free soldering material ( 5) on at least one contact surface (7) at the bottom of a connecting element (3), arrange the connecting element (3), with lead-free solder material (5), on an electrically conductive structure (2) on a substrate (1), weld the connecting element (3) to the electrically conductive structure (2).
    [0004]
    4. Method according to claim 3, characterized in that it further comprises subsequently plastically reshaping the connecting bridge (4) by loading on one side only at the end of the connecting bridge (4).
    [0005]
    5. Use of a panel as defined in claim 1, characterized in that it is like a panel with electrically conductive structures.
    [0006]
    6. Panel according to claim 1, characterized in that the connecting bridge (4) contains 58% by weight to 99.9% by weight of copper.
    [0007]
    7. Panel according to claim 1, characterized in that the connecting bridge (4) contains 60% by weight to 80% by weight of copper and 20% by weight to 40% by weight of zinc.
    [0008]
    8. Panel according to claim 1, characterized in that the electrical resistance of the connecting bridge (4) is between 0.5 μ Ohm.cm and 20 μ Ohm.cm.
    [0009]
    9. Panel according to claim 1, characterized in that the electrical resistance of the connecting bridge (4) is between 1.0 μ Ohm.cm and 15 μ Ohm.cm.
    [0010]
    10. Panel according to claim 1, characterized in that the electrical resistance of the connecting bridge (4) is between 1.5 μ Ohm.cm and 11 μ Ohm.cm.
    [0011]
    11. Panel according to claim 1, characterized in that the connecting element (3) contains at least one of titanium, iron, nickel, cobalt, molybdenum, copper, zinc, tin, manganese, niobium, chromium and your leagues.
    [0012]
    12. Panel according to claim 1, characterized in that the connecting element (3) contains iron alloys.
    [0013]
    13. Panel according to claim 1, characterized in that the connecting bridge (4) contains at least one of titanium, iron, nickel, cobalt, molybdenum, zinc, tin, manganese, niobium, silicon, chromium and your leagues.
    [0014]
    14. Panel according to claim 1, characterized in that the electrically conductive structure (2) contains silver and has a layer thickness of 5 μ m to 40 μ m.
    [0015]
    15. Panel according to claim 1, characterized in that the electrically conductive structure (2) contains silver particles and glass frits.
    [0016]
    16. Panel according to claim 1, characterized in that the substrate (1) contains glass
    [0017]
    17. Panel according to claim 1, characterized in that the substrate (1) contains at least one of flat glass, float glass, quartz glass, borosilicate glass and soda-lime glass.
    [0018]
    18. Panel according to claim 1, characterized in that the lead-free solder material (5) contains at least one of tin, bismuth, indium, zinc, copper, silver and their alloys.
    [0019]
    19. Panel according to claim 1, characterized in that the lead-free solder material (5) contains 35% by weight to 69% by weight of bismuth, 30% by weight to 50% by weight of tin and 1 wt% to 10 wt% silver.
    类似技术:
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    同族专利:
    公开号 | 公开日
    DE202013006775U1|2013-09-10|
    AR092592A1|2015-04-29|
    PL2923528T3|2017-07-31|
    AU2013350058A1|2015-06-11|
    ZA201503297B|2016-05-25|
    ES2621224T3|2017-07-03|
    MA38103B1|2017-03-31|
    EP2923528A1|2015-09-30|
    EA029913B1|2018-05-31|
    TWI542560B|2016-07-21|
    MX352466B|2017-11-27|
    EA201590991A1|2016-05-31|
    AU2013350058B2|2016-08-18|
    DK2923528T3|2017-04-10|
    MY181332A|2020-12-21|
    JP2016506020A|2016-02-25|
    US9635758B2|2017-04-25|
    HUE032460T2|2017-09-28|
    JP6584465B2|2019-10-02|
    BR112015010476A2|2017-07-11|
    CN104798439B|2016-10-19|
    WO2014079594A1|2014-05-30|
    EP2923528B1|2017-01-04|
    CA2890287A1|2014-05-30|
    US20150296615A1|2015-10-15|
    PT2923528T|2017-04-11|
    TW201427919A|2014-07-16|
    MA38103A1|2016-08-31|
    MX2015006369A|2015-10-05|
    KR20150073206A|2015-06-30|
    CN104798439A|2015-07-22|
    KR101821465B1|2018-01-23|
    CA2890287C|2018-01-02|
    JP2018029064A|2018-02-22|
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    法律状态:
    2018-12-04| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|
    2019-12-24| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|
    2021-07-20| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2021-08-10| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 16/07/2013, OBSERVADAS AS CONDICOES LEGAIS. |
    优先权:
    申请号 | 申请日 | 专利标题
    EP12193522|2012-11-21|
    EP12193522.5|2012-11-21|
    PCT/EP2013/064987|WO2014079594A1|2012-11-21|2013-07-16|Disk comprising electric connecting element and connecting bridge|
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